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Nikon Z 7
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10.0
FujiFilm X-T3
ST-Ericsson to restructure, possibly be acquired by AMD, Intel, NVIDIA, or TI
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ST-Ericsson, the joint venture between Sweden’s Ericsson and France’s STMicroelectronics, is planning on undergoing a restructuring event within the next few weeks which may position the struggling mobile chipmaker to be viewed as a “strategic asset” by potential buyers.
The restructuring event is expected to include site closures and major layoffs. This plan to lower costs is due to be unveiled by Didier Lamouche, Chief Executive, by the end of March.
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First glimpse of the Intel-Samsung Tizen OS gallery surface, looks like a DNA spiral (video)
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MeeGo gets to live in Intel and Samsung's labs in the form of the open-source Tizen mobile OS, which is apparently prepped to be the newest playground in the quest to take on Android, iOS and Windows Phone.
Samsung already said that Tizen and its own mobile OS bada might merge one day, and the Tizen project was also endorsed by Huawei recently. We've seen the typical grid of thumbnails when it comes to the gallery in early Tizen alphas, but things are apparently progressing as a new leak shows a revamped 3D interface there.
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AMD's acquisition of SeaMicro puts Intel on the defensive
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Intel suffered a setback in the server market last week with the news that its former partner, SeaMicro, is being acquired by AMD. But the world's top chip maker said it was internally developing technology to remain competitive in the dense server market.
Intel is developing integrated fabrics to boost I/O and high-performance networking and storage in servers, said Jason Waxman, general manager of Intel's data center business unit, in an interview. The technologies are being developed as the company tries to boost its presence in the market for dense servers used in cloud computing deployments in data centers.
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New Cisco servers have Intel Xeon E5 inside
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Cisco this week expanded its data center portfolio with servers and networking gear to better support virtualization, cloud computing and big data.
Cisco says the rollout represents its third-generation fabric computing platform and addresses data center scale and promptness in responding to changing business needs.
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Server makers announce new offerings with Intel's E5 chips
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Top server makers on Tuesday announced major product upgrades with Intel's new Xeon E5 processors and technologies that deliver better performance and throughput for robust virtualization and cloud deployments in data centers.
Intel on Tuesday announced the Xeon E5-2600 series chips, which succeed the Xeon 5600 chips announced in March 2010. IBM, Hewlett-Packard and Dell concurrently announced servers with Intel's new chips, and have also packed new networking and bus technologies that improve bandwidth for faster deployment of virtual machines.
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Intel Wants PCI Express 3.0 Inside Thunderbolt
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Intel's Thunderbolt interconnect interface may not be mainstream just yet, but Intel is determined to push it forward making use of the latest PCI Express 3.0 standard.
Right now, Thunderbolt does not even come close to its full potential, mostly because it uses copper wires instead of optical cables.
Had it been made with fiber optics from the start, it would have easily attained its apex of 50 Gbps, but the current iteration only hovers around 10 Gbps. Still, not only does the standard relay data, but it integrates the DisplayPort connection as well, for displays.
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Intel Ivy Bridge touchscreen Ultrabook reference design
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Interested in replacing both your tablet and that clunky notebook with a svelte all-in-one portable? Intel might have just the gadget for you -- an Ivy Bridge Ultrabook with a built-in 13.3-inch 1600 x 900-pixel capacitive-touch LCD. We happened upon such a device in the bowels of Intel's gaming-centric CeBIT booth, and had a chance to go hands-on with the company's one and only (at this show, at least) reference design touchscreen Ultrabook. The device we saw appeared to be no larger or thicker than similar portables, but integrated a gorgeous 13.3-inch touchscreen, along with that elusive 1.5GHz Ivy Bridge processor. Unfortunately Intel was mum on detailed specs, though the prototype we sa...
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Intel roadmap teases 14nm mobile chips in 2014
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Intel showed off its mobile chip roadmap today at MWC 2012, featuring an ambitious plan that Intel CEO Paul Otellini believes will “light a fire under” Apple, Samsung, and LG. For this year, the company has set 32nm architecture chips with its Medfield Atom Z2460 processors. (Make sure to check out our hands-on with the Intel Orange “Santa Clara” Medfield phone). But next year, it’s shrinking its chips down to a new 22nm process and then further to 14nm by 2014.
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Intel CEO: mobile phone processor cores don�t matter
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In a move that the Intel CEO and president joked “may have just started another core war”, Paul Otellini has dismissed the importance of cores in mobile phone CPUs.
With the rest of the market racing towards quad-core processors on Android 4.0 Ice Cream Sandwich phones, Otellini very bluntly replied to comparisons with his company’s Medfield processor at the Intel press conference at Mobile World Congress 2012.
“I don’t think it [the number of cores] matters. What matters is the chip itself," he said. "The core comparison is really improper in my mind. What does matter is the performance and the efficiency of that performance.”
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Intel announces new processors and partnerships
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Intel on Monday detailed a number new products and partnerships during the company’s Mobile World Congress press event. “We are very pleased to add new, important customers and capabilities to our phone offerings today. We remain focused on delivering exciting new features and outstanding performance to smartphone customers around the world.” said Intel CEO Paul Otellini. UK service provider Orange will launch an Atom-powered smartphone based on the Z2460 reference design. The device will feature a sleek body that will enable “rich entertainment experiences [to] Orange services, including Orange TV, Daily Motion, Deezer, Orange Wednesdays and Orange Gestures.” The handset is scheduled for a ...
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HP reportedly planning Windows 8 tablets using Intel and Qualcomm processors
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HP CEO Meg Whitman recently told investors that the company will be shipping Windows 8 products by the end of the year, and now CNET is reporting some possible details about its tablet plans. According to the site, HP is working on at least three different Windows 8 tablets, powered by chips from Intel and Qualcomm. The two Intel models are said to utilize the chipmaker's 32nm Atom Clover Trail platform, and will come in two distinct form factors. The first is reportedly a laptop / tablet hybrid — a device type that some of HP's competitors believe in — while the second is a more traditional tablet aimed at business customers. The third product is said to be powered by a Qualcomm processor, ...
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Intel Z77 Chipset Motherboards to Start Selling in Early-April
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Regardless of whether you'll be able to get an "Ivy Bridge" Core processor till the second week of April, motherboards that are compatible with it out of the box, based on Intel's Z77 chipset (successor to Z68), will start selling in early-April. Sources told OCWorkbench that most motherboard vendors have in fact begun shipping orders to their distributors, while some are waiting for the green light. Motherboards based on the Z77 chipset feature LGA1155 CPU socket, are compatible with today's "Sandy Bridge" Core i3, Core i5, and Core i7 processors; and tomorrow's "Ivy Bridge" ones, out of the box. The new chipset offers features such as some native USB 3.0 ports, and support for certain Ivy ...
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Intel Takes a 'Deliberate' Approach to New Foundry Effort
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Intel has been offering semiconductor manufacturing services to third-party customers without a whole lot of fanfare as it brings its state-of-the-art 22-nanometer fabs online. That's precisely how the company wants it, according to Intel spokesman Chuck Mulloy.
The chip giant decided a while back to add foundry services to its portfolio as a way to take advantage of extra capacity at its next-generation fabs. So far Intel has only officially announced a pair of customers—it's making 22nm field-programmable gate arrays (FPGAs) for Achronix Semiconductor and Tabula—and isn't making more noise about its foundry business because it's a "very nascent effort," Mulloy said.
"We think we're the bes...
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Intel to launch new caching SSDs to go with Ivy Bridge
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Despite some confusion as to whether Intel’s next-generation processor architecture had been delayed, it turns out that only the dual-core mobile chips will be held back, with quad core parts expected to arrive on track in April. Now details are emerging of Intel's new range of caching solid state disks to be released alongside Ivy Bridge.
Intel's new 313 Series solid state disks will utilize 25nm process SLC NAND flash memory, and will be built specifically with caching in mind alongside the Ivy Bridge lineup. SLC flash has much lower write latency than MLC and typically handles around 20 times more program/erase cycles, making it perfectly suited to scenarios involving continuous read/writ...
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Intel moves ahead with wireless integration into mobile chips
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Intel is expected to share details this week about its effort to work wireless capabilities into chips, which could make mobile devices and PCs smaller, cheaper and more power-efficient.
The company will give more details about a dual-core Atom chip code-named Rosepoint, with integrated Wi-Fi capabilities, at the International Solid-State Circuits Conference being held in San Francisco Feb. 19-23.
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