ASRock H55M-GE specs
General info
Micro ATX
Form factor:
Intel
Socket:
LGA 1156 / Socket H
No
Dual socket:
Intel H55
Chipset:
Main features
1 x PCI Express x16 slot
PCI Express slots:
1 x PCI Express x1 slot
2.x
PCI Express version:
2
PCI slots:
5.1
Audio type:
High definition audio
Audio features:
Speed: 1000 Mbps , Chipset: Realtek RTL8111E , Supports Wake-On-LAN: Yes
LAN:
RAM Memory
DDR3 (240-pin)
Type:
DDR3-2200
4
Slots:
Dual-channel
Capacity:
16 GB
Maximum:
4 GB
Maximum per slot:
Storage interface
SATA II (3GB/s): 6
Ports:
Graphics
Yes
Integrated card:
Intel
Manufacturer:
1759 MB
Shared memory:
BIOS
16 MB
BIOS memory:
1.1
ACPI:
Connectivity
Version 1.1 / 2.0 (back panel: 6, mid-board: 6)
USB:
1 x CPU fan headers , 1 x power fan header , 1 x S/PDIF Out headers , 1 x serial port headers , 1 x parallel port headers , 1 x PS/2
Internal I/O connectors:
HDMI, DVI, VGA (D-Sub)
Video:
Other features
CPU / System / North Bridge temperature detection, CPU / System / Power fan speed detection, CPU / System fan speed control, CPU quiet fan, System voltage detection
Hardware monitoring:
Passive
Chipset cooling:
Yes
Solid capacitors:
ASRock OC Tuner, Intelligent Energy Saver, Instant Boot, ASRock Instant Flash, ASRock OC DNA, ASRock AIWI, ASRock APP Charger, CPU Frequency Stepless Control, ASRock U-COP, Boot Failure Guard (B.F.G.), Good Night LED
Unique features:
Warranty
Quick Installation Guide, Support CD, I/O Shield
Accessories:
also know as: ASRock H55M-GE R2.0
If you are interested in using our specs commercially, check out our Motherboards specs database licensing page.
Filed in: ASRock Motherboards
Highly rated gadgets
-
10.0
Nikon Z 7
-
9.0
Panasonic LUMIX LX100 II
-
8.0
BlackBerry Motion
-
10.0
FujiFilm X-T3
-
8.5
Xiaomi Mi A2
-
9.0
Sony WH-1000XM3
-
9.1
Apple iPhone XS Max
-
9.1
Apple iPhone XS
-
9.0
FujiFilm XF10
