Foxconn A55MX specs
General info
Micro ATX
Form factor:
AMD
Socket:
FM1
AMD sockets:
No
Dual socket:
A55
Chipset:
Main features
1 x PCI Express x16 slot running at x16
PCI Express slots:
1 x PCI Express x1 slot running at x1
No
AGP slot:
5.1
Audio type:
High definition audio
Audio features:
Speed: 1000 Mbps
LAN:
No
Wi-Fi:
RAM Memory
DDR3 (240-pin)
Type:
DDR3-1600
2
Slots:
Dual-channel
Capacity:
32 GB
Maximum:
16 GB
Maximum per slot:
Storage interface
SATA II (3GB/s): 4
Ports:
Yes
RAID support:
0 , 1, 10
SATA II (3GB/s) RAID:
Graphics
No
Integrated card:
BIOS
16 MB
BIOS memory:
No
DualBIOS :
No
Clearing CMOS jumper:
ACPI, WfM, DMI 2.0
Other BIOS features:
Connectivity
Version 1.1 / 2.0 (back panel: 6, mid-board: 4)
USB:
No
Thunderbolt:
2 x CPU fan headers , 1 x serial port headers , 1 x PS/2
Internal I/O connectors:
No
IEEE 1394:
HDMI, VGA (D-Sub)
Video:
Other features
Passive
Chipset cooling:
No
On/Off Charge USB Support:
No
JBOD :
No
Auto Unlock Support:
Links
Official page:
-
in English:
-
If you are interested in using our specs commercially, check out our Motherboards specs database licensing page.
Filed in: Foxconn Motherboards
Description: The A55MX Support FM1 socket CPU.offers enhanced connectivity and entertainment capability, backed-up by high-performance features and components. Based on the AMD A55 (Hudson D2) chipset with an advanced DirectX 11 graphics engine and AMD UVD 3.0 technology. UVD supports Blue-Ray and HD-DVD content, whilst offloading power and processor-intensive video decoding from the CPU to the graphics core.Supporting AMD the Llano APU processors... read more
Highly rated gadgets
-
10.0
FujiFilm X-T3
-
8.0
BlackBerry Motion
-
9.0
FujiFilm XF10
-
9.0
Panasonic LUMIX LX100 II
-
9.0
Sony WH-1000XM3
-
10.0
Nikon Z 7
-
9.1
Apple iPhone XS
-
8.5
Xiaomi Mi A2
-
9.1
Apple iPhone XS Max
