ASRock H61M-VS specs
General info
Intel
Socket:
LGA 1155
No
Dual socket:
Intel H61
Chipset:
Main features
1 x PCI Express x16 slot running at x16
PCI Express slots:
1 x PCI Express x1 slot
2.x
PCI Express version:
5.1
Audio type:
High definition audio
Audio features:
Speed: 100 Mbps , Chipset: Atheros AR8152 , Supports Wake-On-LAN: Yes
LAN:
RAM Memory
DDR3 (240-pin)
Type:
DDR3-1333
2
Slots:
Dual-channel
Capacity:
16 GB
Maximum:
8 GB
Maximum per slot:
Storage interface
SATA II (3GB/s): 4
Ports:
Graphics
Yes
Integrated card:
Intel
Manufacturer:
HD Graphics 2000
Model:
1759 MB
Shared memory:
BIOS
32 MB
BIOS memory:
1.1
ACPI:
Connectivity
Version 1.1 / 2.0 (back panel: 6, mid-board: 4)
USB:
1 x CPU fan headers , 1 x power fan header , 1 x serial port headers , 1 x parallel port headers , 2 x PS/2
Internal I/O connectors:
VGA (D-Sub)
Video:
Other features
CPU / System / North Bridge temperature detection, CPU / System / Power fan speed detection, CPU / System fan speed control, CPU quiet fan, System voltage detection
Hardware monitoring:
Passive
Chipset cooling:
Yes
Solid capacitors:
ASRock Extreme Tuning Utility (AXTU), Instant Boot, ASRock Instant Flash, ASRock AIWI, ASRock APP Charger, SmartView, ASRock XFast USB, ASRock U-COP, Boot Failure Guard (B.F.G.), Combo Cooler Option (C.C.O.), Good Night LED
Unique features:
Warranty
Quick Installation Guide, Support CD, I/O Shield
Accessories:
also know as: ASRock H61M-VS R2.0
If you are interested in using our specs commercially, check out our Motherboards specs database licensing page.
Filed in: ASRock Motherboards
Highly rated gadgets
-
10.0
Nikon Z 7
-
10.0
FujiFilm X-T3
-
8.0
BlackBerry Motion
-
9.0
FujiFilm XF10
-
9.0
Panasonic LUMIX LX100 II
-
9.0
Sony WH-1000XM3
-
8.5
Xiaomi Mi A2
-
9.1
Apple iPhone XS Max
-
9.1
Apple iPhone XS
