BIOSTAR TH55B HD Ver. 6.x specs
General info
Intel
Socket:
LGA 1156 / Socket H
No
Dual socket:
Intel H55
Chipset:
Main features
1 x PCI Express x16 slot
PCI Express slots:
1 x PCI Express x1 slot
2.x
PCI Express version:
2
PCI slots:
5.1
Audio type:
High definition audio
Audio features:
Speed: 1000 Mbps , Chipset: Realtek RTL8111DL
LAN:
No
Wi-Fi:
RAM Memory
DDR3 (240-pin)
Type:
DDR3-2000
4
Slots:
Dual-channel
Capacity:
16 GB
Maximum:
4 GB
Maximum per slot:
Storage interface
SATA II (3GB/s): 6 , PATA: 1
Ports:
Graphics
Yes
Integrated card:
BIOS
BIO-ReLife, T-Overclocker
Other BIOS features:
Connectivity
Version 1.1 / 2.0 (back panel: 4, mid-board: 6)
USB:
No
Powered while off:
1 x CPU fan headers , 2 x system fan headers , 1 x S/PDIF Out headers , 1 x serial port headers , 1 x parallel port headers , 1 x PS/2
Internal I/O connectors:
HDMI, DVI, VGA (D-Sub)
Video:
Other features
Passive
Chipset cooling:
Yes
Solid capacitors:
No
On/Off Charge USB Support:
No
JBOD :
No
Auto Unlock Support:
Warranty
3 x SATA Cable, 1 x SATA Power Cable, 1 x I/O Shield, 1 x CD Driver, 1 x User Manual
Accessories:
Links
Official page:
-
in English:
-
If you are interested in using our specs commercially, check out our Motherboards specs database licensing page.
Filed in: BIOSTAR Motherboards
Description:
5-phase VRM design with high quality power components such as low RDS (on) Mosfet for lower temperature has the advantage to raise the overclocking ability.
BIOSTAR G.P.U (Green Power Utility) is a new function that enhances energy efficiency by disabling extra phases while CPU is under light loading. It integrates a friendly GUI to monitor the resourcing and response of your CPU thus optimizing the power saving function in your... read more
Highly rated gadgets
-
8.5
Xiaomi Mi A2
-
10.0
FujiFilm X-T3
-
8.0
BlackBerry Motion
-
9.1
Apple iPhone XS
-
10.0
Nikon Z 7
-
9.1
Apple iPhone XS Max
-
9.0
Panasonic LUMIX LX100 II
-
9.0
Sony WH-1000XM3
-
9.0
FujiFilm XF10
