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BIOSTAR TH67+ Ver. 6.x specs

General info

  • Micro ATX

    Form factor:

  • Intel

    Socket:

    • LGA 1155

    • No

      Dual socket:

  • Intel H77

    Chipset:

Main features

  • 1 x PCI Express x16 slot running at x16

    PCI Express slots:

  • 1 x PCI Express x16 slot running at x4

  • 1 x PCI Express x1 slot

  • 2.x

    PCI Express version:

  • 1

    PCI slots:

  • Yes

    Multi-graphics support:

  • ATI Crossfire

  • Other

    Audio type:

  • Blu-ray audio support

    Audio features:

  • Speed: 1000 Mbps , Chipset: Realtek RTL8111E

    LAN:

  • No

    Wi-Fi:

RAM Memory

  • DDR3 (240-pin)

    Type:

  • DDR3-1333

  • 4

    Slots:

  • Dual-channel

  • Capacity:

    • 16 GB

      Maximum:

    • 4 GB

      Maximum per slot:

Storage interface

  • SATA II (3GB/s): 4 , SATA III (6GB/s): 2

    Ports:

  • Yes

    RAID support:

  • 0 , 1, 5, 10

    SATA II (3GB/s) RAID:

  • 1, 5, 10

    SATA III (6GB/s) RAID:

Graphics

  • Yes

    Integrated card:

Connectivity

  • Version 1.1 / 2.0 (back panel: 2, mid-board: 6), Version 3.0 (back panel: 3)

    USB:

  • 1 x CPU fan headers , 2 x system fan headers , 1 x S/PDIF Out headers , 1 x serial port headers , 1 x PS/2

    Internal I/O connectors:

  • HDMI, DVI

    Video:

Other features

  • Passive

    Chipset cooling:

  • Yes

    Solid capacitors:

  • No

    On/Off Charge USB Support:

  • No

    JBOD :

  • Yes

    Auto Unlock Support:

Warranty

  • 3 x SATA Cable, 1 x SATA Power Cable, 1 x I/O Shield, 1 x CD Driver, 1 x User Manual

    Accessories:

US Availability

  • Available

    Market status:

European Availability

  • Available

    Market status:

Links

  • Official page:


If you are interested in using our specs commercially, check out our Motherboards specs database licensing page.


Filed in: BIOSTAR Motherboards

Description: Experience Fastest data transfers at 5 Gbps with USB 3.0--the new latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and backward compatible with previous USB 2.0 components.
100% Solid Caps
With armor-plated Biostar Technology, all capacitors are placed with 100% solid capacitors that have a lasting life cycle, durability and stability for crucial... read more

Created by MG3 , Last update by MG2 , May 04, 2012

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