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BIOSTAR TF7050-M2 Ver. 5.x specs


BIOSTAR TF7050-M2 Ver. 5.x

General info

  • Micro ATX

    Form factor:

  • AMD

    Socket:

    • Socket AM2

      AMD sockets:

    • No

      Dual socket:

  • Other (NVIDIA GeForce 7050PV / nForce 630a)

    Chipset:

  • 2000 MT/s

    Hyper Transport Bus:

Main features

  • 1 x PCI Express x16 slot

    PCI Express slots:

  • 1 x PCI Express x1 slot

  • 2

    PCI slots:

  • No

    AGP slot:

  • No

    Multi-graphics support:

  • Other

    Audio type:

  • High definition audio

    Audio features:

  • Speed: 1000 Mbps , Chipset: Realtek RTL8111B

    LAN:

  • No

    Wi-Fi:

RAM Memory

  • DDR2

    Type:

  • DDR2-800

  • 4

    Slots:

  • Dual-channel

  • Capacity:

    • 8 GB

      Maximum:

    • 2 GB

      Maximum per slot:

Storage interface

  • SATA II (3GB/s): 4 , PATA: 1

    Ports:

  • Yes

    RAID support:

  • 0 , 1, 5

    SATA II (3GB/s) RAID:

Graphics

  • Yes

    Integrated card:

  • NVIDIA

    Manufacturer:

    • GeForce

  • 7050PV GPU

    Model:

Connectivity

  • Version 1.1 / 2.0 (back panel: 4, mid-board: 6)

    USB:

    • No

      Powered while off:

  • 1 x CPU fan headers , 2 x system fan headers , 1 x North Bridge fan header , 1 x S/PDIF Out headers , 1 x CD In connector , 1 x serial port headers , 1 x parallel port headers , 1 x floppy disk drive connector , 2 x PS/2

    Internal I/O connectors:

  • No

    IEEE 1394:

  • HDMI, VGA (D-Sub), S-Video

    Video:

Other features

  • Passive

    Chipset cooling:

  • Yes

    Solid capacitors:

  • No

    On/Off Charge USB Support:

  • No

    JBOD :

  • No

    Auto Unlock Support:

Warranty

  • 1 x IDE Cable, 1 x FDD Cable, 2 x SATA Cable, 1 x SATA Power Cable, 1 x I/O Shield, 1 x CD Driver, 1 x User Manual

    Accessories:

Links

  • Official page:


If you are interested in using our specs commercially, check out our Motherboards specs database licensing page.


Filed in: BIOSTAR Motherboards

Description: There are a couple of nice nods towards the user experience like a set of hard Power and Reset buttons on the PCB.
Also fully passive thermal solutions for each chipset is eye-catching. The large and higher heatsink attached to the NB to dissipate heat efficiently. The heatsink above the SB will cool down the temperature rapidly.
Solid electrolytic capacitors, using conductive polymer materials will extend the live-span of the... read more

Created by MG3 , Last update by MG20 , Mar 16, 2011

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