BIOSTAR H55A+ Ver. 6.0 specs
General info
ATX
Form factor:
Intel
Socket:
LGA 1156 / Socket H
No
Dual socket:
Intel H55
Chipset:
Main features
1 x PCI Express x16 slot running at x16
PCI Express slots:
1 x PCI Express x16 slot running at x4
1 x PCI Express x1 slot
2.x
PCI Express version:
2
PCI slots:
5.1
Audio type:
High definition audio
Audio features:
Speed: 1000 Mbps , Chipset: Realtek RTL8111DL
LAN:
RAM Memory
DDR3 (240-pin)
Type:
DDR3-1600
4
Slots:
Dual-channel
Capacity:
16 GB
Maximum:
4 GB
Maximum per slot:
Storage interface
SATA II (3GB/s): 6
Ports:
Graphics
Yes
Integrated card:
Connectivity
Version 1.1 / 2.0 (back panel: 4, mid-board: 6)
USB:
1 x CPU fan headers , 2 x system fan headers , 1 x S/PDIF Out headers , 1 x serial port headers , 1 x parallel port headers , 1 x PS/2
Internal I/O connectors:
No
IEEE 1394:
HDMI, DVI, VGA (D-Sub)
Video:
Other features
Passive
Chipset cooling:
Yes
Solid capacitors:
No
JBOD :
No
Auto Unlock Support:
Warranty
2 x SATA Cable, 1 x I/O Shield, 1 x CD Driver, 1 x Quick Guide
Accessories:
US Availability
Available
Market status:
European Availability
Available
Market status:
Links
Official page:
-
in English:
-
also know as: BIOSTAR H55A+ Ver. 6.1, BIOSTAR H55A+ Ver. 6.2
If you are interested in using our specs commercially, check out our Motherboards specs database licensing page.
Filed in: BIOSTAR Motherboards
Description:
Supports the Intel Core i7 / i5 / i3 / Pentium Processors in the LGA1156 Package
Intel H55 single chip architecture
5 Phases Power Design
Support 4-DIMM 1866(OC)/1600(OC)/1333/1066
Integrated HDMI/DVI interface with HDCP Supporting all HD formats including 720P, 1080i, 1080P. ( Required processors with Intel HD Graphics )
CPU integrated Graphics performance tunable via BIOS
Optimized to deliver full windows 7 Experience
Highly rated gadgets
-
9.0
FujiFilm XF10
-
8.0
BlackBerry Motion
-
9.1
Apple iPhone XS Max
-
8.5
Xiaomi Mi A2
-
9.0
Sony WH-1000XM3
-
10.0
FujiFilm X-T3
-
9.0
Panasonic LUMIX LX100 II
-
9.1
Apple iPhone XS
-
10.0
Nikon Z 7
