TSMC may beat Intel with world’s first 3D chips
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Taiwan Semiconductor Manufacturing Co. is vying with Intel to become the first company to sell three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1,000 times.
TSMC, the world's largest contract chipmaker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who requested anonymity. »read more
More at: InfoWorld Add additional source
Filed in: Intel