Apple Seeks to Patent Thinner Headphone Jack

Apple has applied for a new patent that would halve the size of audio jacks for headphones and the ports needed to accommodate them. The jacks would be sliced in half lengthwise, decreasing the thickness from today's standard 3.5mm to 1.75mm. The housing for the jack would be placed on the outer edge of a device, rather than buried internally. The patent application notes that this would cause a few problems and Apple proposes how to solve them. First, though existing jacks would fit into the new design, there's nothing holding them in place, so they'd fall out. Apple proposes to solve this by creating a magnetic interface to hold the jack in place. Second, the half-exposed jacks would be vi... »read more

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