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General info

  • Manufacturer:

  • Model:

  • Codename:

Main features

  • min GHz

    Operating frequency:

  • Cores:

  • min

    Threads:

  • min MHz

    Front side bus (FSB):

  • max W

    Thermal Design Power (TDP):

  • Manufactoring technology:

  • VID Voltage Range:

    • max V

      From:

    • min V

      To:

  • Cache:

    • min

      L1:

    • min

      L2:

    • min

      L3:

  • CPU Architecture:

  • Architecture extensions:

  • Stepping / Revision:

  • Supplemental SKU:

  • max

    Tjunction:

  • exactly mm2

    Processing Die Size:

  • min millions

    Processing Die Transistors:

Additional features

  • Integrated graphics:

  • Integrated memory controller:

Body

  • Package dimensions (WxHxD):

    • max

      width:

    • max

      height:

    • max

      depth:

  • min max

    Package weight:

Warranty

  • min

    Warranty period:

US Availability

  • Market status:

European Availability

  • Market status:

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